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Spherical silicon micropowder technology uses low-cost natural high-quality powder quartz minerals as the basic raw material. It is currently made using two main processes: 1. Using sol-gel technology, in the presence of dispersants and spherical catalysts, high-purity spherical nano-amorphous silicon micropowder that meets the requirements of electronic packaging materials is prepared; 2. Amorphous silicon micropowder is melted into spherical shapes using flame or ion flame methods. In the high-end user market, such as integrated circuit packaging, the second process is used.

Spherical silicon micropowder is mainly used for large-scale integrated circuit packaging, and is also used in high-tech fields such as aviation, aerospace, fine chemicals, rewritable optical disks, large-area electronic substrates, special ceramics and daily cosmetics. It can save a lot of epoxy resin when used as a filler in the epoxy resin system.


BrandSiCSPAl
  (Type)
Si50 A5080.10.055
Si50 B50150.10.13
Si606050.080.055
Si656550.080.055


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